Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Molded semiconductor package with dual integrated heat spreaders

Molded semiconductor package with dual integrated heat spreaders

US Patent 11929298 · Granted Mar 12, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor packages including a package body with grooves formed therein2025
Method for fabricating a semiconductor device including an embedded semiconducto2025
Multi-chip device with gate redistribution structure2025
Electronic module including a semiconductor package disposed on an interposer la2025
Semiconductor package and method of manufacturing a semiconductor package2025
Package with load terminals on which coupled power component and logic component2025
Power semiconductor device and method2025
Cryostat socket for holding an ion trap device mounted on a substrate in a cryos2025
Semiconductor package2025
Semiconductor package2025
Semiconductor device package comprising a thermal interface material with improv2025
Semiconductor device with improved performance in operation and improved flexibi2025