Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with multiple interposers on a single substrate

Semiconductor package with multiple interposers on a single substrate

US Patent 11923347 · Granted Mar 5, 2024

Estimated economic value: $300,464,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package with capacitance die2024
Highly available modular hardware acceleration device2024
Semiconductor package with stiffener ring having elevated opening2024
Fruit and vegetable coring machine2006