Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Silicon photonic interposer with two metal redistribution layers

Silicon photonic interposer with two metal redistribution layers

US Patent 11923327 · Granted Mar 5, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Data processing systems including optical communication modules2025
Communication systems having pluggable modules2025
Communication systems having co-packaged optical modules2025
Communication systems having pluggable modules2025
Packaging of three-dimensional integrated circuit by encapsulation with copper p2025
Through mold via frame2025
Siliconized heterogeneous optical engine2025
Siliconized heterogeneous optical engine2025
Data processing systems including optical communication modules2025
Silicon photonic edge coupled connector via collimation2025
Photonic integrated circuits with controlled collapse chip connections2025
Integrated self-aligned assembly2024