Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming RF devices with enhanced performance including attaching a wafer to a support carrier by a bonding technique without any polymer adhesive

Method of forming RF devices with enhanced performance including attaching a wafer to a support carrier by a bonding technique without any polymer adhesive

US Patent 11923238 · Granted Mar 5, 2024

Estimated economic value: $12,926,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lateral field excitation acoustic resonator2025
Control method for switches based on dual phase materials2025
Multi-level 3D stacked package and methods of forming the same2025
Top electrodes and dielectric spacer layers for bulk acoustic wave resonators2025
RF devices with enhanced performance and methods of forming the same2025
Bulk acoustic wave filter structure with conductive bridge forming electrical lo2025
RF devices with enhanced performance and methods of forming the same2024
Microelectronics package with vertically stacked MEMS device and controller devi2024
RF devices with enhanced performance and methods of forming the same utilizing l2024
RF devices with enhanced performance and methods of forming the same2024
RF devices with enhanced performance and methods of forming the same2024
Top electrodes and dielectric spacer layers for bulk acoustic wave resonators2024