Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joined

Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joined

US Patent 11908766 · Granted Feb 20, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Clip structure for semiconductor package and semiconductor package including the2025
Semiconductor package and method of manufacturing the same2024
Semiconductor package2024
System for cooling semiconductor component, method of manufacturing the same, an2024
Semiconductor package, method of manufacturing the same and metal bridge applied2024
Apparatus for attaching semiconductor parts2023
Semiconductor package with metal post having non-vertical structure2023
Coupled semiconductor package2023
Semiconductor package with heat radiation board2023
Semiconductor package2023
Method of manufacturing semiconductor having double-sided substrate2023
Plurality of power semiconductor chips between a substrate and leadframe2022