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Home › Soldering printed circuits using radiant heat

Soldering printed circuits using radiant heat

US Patent 11903143 · Granted Feb 13, 2024

Estimated economic value: $276,460,000 ⓘ

Assignee

Microsoft

Inventors

David Christopher Perna (1 patents)
Elisa Naseem Haqq (1 patents)
Daniel Tusteh Chian (1 patents)
Kevin PHAM (4 patents)

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