Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal and/or optical signature simulating systems and methods of making and using such systems

Thermal and/or optical signature simulating systems and methods of making and using such systems

US Patent 11892379 · Granted Feb 6, 2024

Estimated economic value: $34,542,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Self-sintering conductive inks2024
Infrared transparent constructs and methods of making them2024
Infrared transparent constructs and methods of making them2024
Wavelength flexibility through variable-period poling of a compact cylindrical o2023
Thermal fuse2023
Edge interconnects for use with circuit boards and integrated circuits2022
Catalyst ink for three-dimensional conductive constructs2021
Catalyst ink for three-dimensional conductive constructs2021
Catalyst ink for three-dimensional conductive constructs2020
Catalyst ink for three-dimensional conductive constructs2020
Hollow stacking cube2018
Plasma torch pilot arc circuit1999