Device, package structure and manufacturing method of device

Assignee

• Xmems Labs

Inventors

• Jemm Yue Liang (76 patents)
• Chiung C. Lo (46 patents)
• Martin Lim (71 patents)
• Wen-Chien Chen (28 patents)
• Michael David Housholder (7 patents)
• David Hong (30 patents)

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