Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor die singulation

Semiconductor die singulation

US Patent 11881434 · Granted Jan 23, 2024

Estimated economic value: $24,621,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Interconnect for IC package2025
Bump to package substrate solder joint2025
Lead frame for a die2024
Leadframe with ground pad cantilever2023
Split tie bar for clip stability2023
Leadframe with ground pad cantilever2022
Selective molding for integrated circuit2022
Package with shifted lead neck2021
Semiconductor device package with grooved substrate2021
Semiconductor die singulation2021
Semiconductor die singulation2021
Siderail with mold compound relief2021