Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for rendering SEM images and predicting defect imaging conditions of substrates using 3D design

System and method for rendering SEM images and predicting defect imaging conditions of substrates using 3D design

US Patent 11880193 · Granted Jan 23, 2024

Estimated economic value: $97,629,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor overlay measurements using machine learning2024
Systems and methods for predicting defects and critical dimension using deep lea2022
Deep learning based adaptive regions of interest for critical dimension measurem2021
Inspection-guided critical site selection for critical dimension measurement2021
Defect discovery using electron beam inspection and deep learning with real-time2021
Guided scanning electron microscopy metrology based on wafer topography2021
Care areas for improved electron beam defect detection2020
Automatic deskew using design files or inspection images2019
Range-based real-time scanning electron microscope non-visual binner2018
Pre-layer defect site review using design2018