Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for preparing void-free coatings for plasma treatment components

Methods for preparing void-free coatings for plasma treatment components

US Patent 11875973 · Granted Jan 16, 2024

Estimated economic value: $84,199,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and methods for automatically handling die carriers2025
Systems for removing or inserting a fastener from or into a wafer carrier2025
Integrated semiconductor die parceling platforms2025
Method and apparatus for securing semiconductor device carrying boat in multi-bo2025
Switching board and soldering method thereof2025
EFEM robot auto teaching methodology2025
Optical inspection of a wafer2025
Cantilever with etch chamber flow design2025
Cantilever with etch chamber flow design2025
Wafer test system and methods2025
Method and system of removing particles from pellicle2025
Wafer alignment apparatus and method for multi-cassette load port2025