Trench isolation structure for image sensors

Assignee

• TSMC

Inventors

• Cheng Yu Huang (68 patents)
• Chun-Hao Chuang (49 patents)
• Keng-Yu Chou (75 patents)
• Wei-Chieh Chiang (52 patents)
• Chin-Chia Kuo (15 patents)
• Wen-Hau Wu (31 patents)
• Hua-Mao Chen (5 patents)
• Chih-Kung Chang (35 patents)

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