Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer breaking method and chip failure analysis method

Wafer breaking method and chip failure analysis method

US Patent 11860073 · Granted Jan 2, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for preparing sample for wafer level failure analysis2023
Unified in-vehicle Wi-Fi service2019
Automatic transmission of reminders for devices left behind2018
Wireless access point detection and use by a vehicle2018
Communication integration via short range wireless connectivity relay2018
Short range wireless communication system for a vehicle2018
Method and device for communicating with a vehicle system module while conservin2018
Locating an in-vehicle near field communication (NFC) antenna2017
Electronic skin, preparation method and use thereof2017
Enabling and disabling low energy, short-range wireless communication modules2017
Integrated circuit with selectable power-on reset mode2017
Method and system for selectively activating a vehicle near field communication 2017