Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach

Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach

US Patent 11854888 · Granted Dec 26, 2023

Estimated economic value: $30,871,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Selective optical tuning of qubit two-level system interactions using bandpass f2025
Water vapor plasma to enhance surface hydrophilicity2025
Steer by wire system for operating steering wheel and steering column2025
Methods and apparatus for mask patterning debris removal2025
Methods and apparatus for mask patterning debris removal2025
High connectivity device stacking2025
Lithium metal surface modification using carbonate passivation2025
Method and apparatus for laser drilling blind vias2025
Gap fill methods using catalyzed deposition2025
Microfluidic system with combined electrical and optical detection for high accu2025
Low resistivity tungsten film and method of manufacture2025
Wafer dicing using femtosecond-based laser and plasma etch2024