Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Etch method for interconnect structure

Etch method for interconnect structure

US Patent 11854870 · Granted Dec 26, 2023

Estimated economic value: $1,986,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Metal gate patterning2025
Semiconductor device and methods of forming the same2025
Device having an air gap adjacent to a contact plug and covered by a doped diele2025
Method for manufacturing semiconductor device2025
Wet cleaning with tunable metal recess for via plugs2025
Wet cleaning with tunable metal recess for via plugs2025
Method for modifying metal-including material in semiconductor manufacturing pro2025
Method for modifying metal-including material in semiconductor manufacturing pro2025
Method for modifying metal-including material in semiconductor manufacturing pro2025
Method of breaking through etch stop layer2025
Method of breaking through etch stop layer2025
Method of breaking through etch stop layer2025