Solder material and method for die attachment

Assignee

• Alpha Assembly Solutions

Inventors

• Angelo Gulino (3 patents)
• Bogdan BANKIEWICZ (2 patents)
• Oscar Khaselev (27 patents)
• Anna Lifton (9 patents)
• Michael T. Marczi (22 patents)
• Girard Sidone (8 patents)
• Paul Salerno (2 patents)
• Paul Joseph Koep (4 patents)

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