Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having interconnection in package and method for manufacturing the same

Semiconductor device having interconnection in package and method for manufacturing the same

US Patent 11837273 · Granted Dec 5, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Source printed circuit board and display device2025
Method and apparatus for transmitting/receiving wireless signal in wireless comm2025
Method and apparatus for transmission prioritization in wireless communication s2025
Method and apparatus for transmitting/receiving wireless signal in wireless comm2025
Method and device for transmitting and receiving sounding reference signals in w2025
Method of transmitting and receiving downlink control channel and apparatus ther2025
System and method for surveying broadcasting ratings2025
HARQ transmission using timers for configured grants and discontinuous reception2025
Method and apparatus for transmitting/receiving wireless signal in wireless comm2025
Sidelink DRX operation based on multiple DRX configurations and prioritization2025
Cosmetic manufacturing apparatus, control method of the same, and cosmetic manuf2025
Device and method for multi-SIM wireless communication2025