Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Imaging device and electronic device configured by bonding a plurality of semiconductor substrates

Imaging device and electronic device configured by bonding a plurality of semiconductor substrates

US Patent 11817471 · Granted Nov 14, 2023

Estimated economic value: $786,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Light receiving element, distance measurement module, and electronic equipment2025
Semiconductor device2025
Imaging device and electronic device2024
Imaging device and electronic device2024
Imaging device and electronic device2024
Solid-state imaging device and electronic apparatus to enhance image quality2024
Solid-state imaging device and electronic apparatus to enhance image quality2024
Semiconductor device2024
Semiconductor device2024
Semiconductor device and method of manufacturing semiconductor device2023
Solid-state imaging device, method of manufacturing solid-state imaging device, 2023
Solid-state imaging device and electronic apparatus2022