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Home › Apparatus and method for providing a scalable ball grid array (BGA) assignment and a PCB circuit trace breakout pattern for RF chip interfaces

Apparatus and method for providing a scalable ball grid array (BGA) assignment and a PCB circuit trace breakout pattern for RF chip interfaces

US Patent 11817378 · Granted Nov 14, 2023

Estimated economic value: $14,245,000 ⓘ

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