Multi-die integrated circuit package

Assignee

• Sitime

Inventors

• Renata Melamud Berger (22 patents)
• Ginel C. Hill (32 patents)
• Paul M. Hagelin (92 patents)
• Charles I. Grosjean (77 patents)
• Aaron Partridge (137 patents)
• Joseph C. Doll (24 patents)
• Markus Lutz (145 patents)

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