Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package including plurality of semiconductor chips on common connection structure

Semiconductor package including plurality of semiconductor chips on common connection structure

US Patent 11791298 · Granted Oct 17, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor chip and semiconductor package including the same2025
Semiconductor package2025
Camera for vehicle2024
Semiconductor package2024
Semiconductor package2024
Driving control system with driving assistance control and autonomous driving co2024
Semiconductor package for reducing stress to redistribution via2023
Multilayer capacitor and board having the same2023
Bridge embedded interposer, and package substrate and semiconductor package comp2022
Semiconductor package2022
Semiconductor package2022
Terminal with hearing aid setting, and method of setting hearing aid2021