Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

US Patent 11776838 · Granted Oct 3, 2023

Estimated economic value: $7,955,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optical film2025
Package structure2025
Package structure2025
Semiconductor device and method of manufacture2025
Integrated circuit package and method2025
Open type breathing-out particles capture and filtration device2025
Lamination process, and manufacturing method of semiconductor package using a ch2025
Fingerprint sensor device and method2025
Semiconductor package system and method2025
Force saving mechanism for circuit board installation2025
Integrated fan-out packages and methods of forming the same2025
Resin composition and article made therefrom2025