Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method

Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method

US Patent 11776820 · Granted Oct 3, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Client-configurable in-transit segmentation of streaming input at managed data t2025
Method, apparatus and system for multi-device cooperation and medium2025
Electric push rod automobile lifting tailgate system2025
Chip package structure, preparation method, and electronic device2025
Chip package structure, preparation method, and electronic device2025
Chip package structure, preparation method, and electronic device2025
Single motor-driven double push rod electric vehicle tailgate system2025
Circuit board with embedded electronic component and manufacturing method thereo2025
Method for manufacturing component embedded circuit board2025
United states low dielectric sealing glass powder for miniature radio-frequency 2024
Circuit board assembly and electronic device2024
Alloy and fabrication thereof2024