Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package substrate having a sacrificial region for heat sink attachment

Package substrate having a sacrificial region for heat sink attachment

US Patent 11757053 · Granted Sep 12, 2023

Estimated economic value: $719,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ni-based superalloy with excellent unsusceptibility to segregation2019
Ni-based superalloy with excellent unsusceptibility to segregation2018
Rotor of rotary machine and rotary machine2017
Back-shielded welding method and welded structure using the same2015
Rotor of rotating machine and method of manufacturing the rotor2014
Steam turbine facility2014
Bolt and manufacturing method of bolt2013
Ni-based alloy high-chrome steel structure and manufacturing method of the same2013
Low thermal expansion Ni-base superalloy2013
Method for producing low thermal expansion Ni-base superalloy2011
Microwave hyperthermia treatment apparatus and treatment system2007
Low thermal expansion Ni-base superalloy2007