Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for the manufacture of integrated devices including a die fixed to a leadframe

Method for the manufacture of integrated devices including a die fixed to a leadframe

US Patent 11756916 · Granted Sep 12, 2023

Estimated economic value: $16,164,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for power module defect detection2025
System and method for power module defect detection2025
Control method for power supply converters, corresponding converter and device2024
Control method and circuit for phase shift regulation of interleaved converters 2024
Back side contact structure for a semiconductor device and corresponding manufac2024
Process for manufacturing a strained semiconductor device and corresponding stra2023
Process for manufacturing a strained semiconductor device and corresponding stra2023
Method to control a variable frequency switching converter, and corresponding va2023
Method for the manufacture of integrated devices including a die fixed to a lead2022
Method for the manufacture of integrated devices including a die fixed to a lead2022
Method for the manufacture of integrated devices including a die fixed to a lead2022
Method for the manufacture of integrated devices including a die fixed to a lead2022