Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and structure to control the solder thickness for double sided cooling power module

Method and structure to control the solder thickness for double sided cooling power module

US Patent 11756915 · Granted Sep 12, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Computer system of unsupervised learning with deep similarity for optical flow e2025
Method of manufacturing a semiconductor device including a conductive line2025
Power module2025
Power module and manufacturing method thereof2025
Motor driving apparatus2025
Power module and motor drive system using the same2025
Double-sided cooling type power module2025
Power module2025
Method and structure to control the solder thickness for double sided cooling po2025
Method and structure to control the solder thickness for double sided cooling po2025
Power module for vehicle and motor driving apparatus including the same2024
Vehicle power module2024