Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Oligomer, composition, packaging structure, and method of disassembling packaging structure

Oligomer, composition, packaging structure, and method of disassembling packaging structure

US Patent 11753502 · Granted Sep 12, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polymer and light-emitting device2024
Double-sided optically clear adhesive and multilayer structure including the sam2023
Double-sided optically clear adhesive and multilayer structure including the sam2023
Double-sided optically clear adhesive and multilayer structure including the sam2023
Methods and devices for graphene formation on flexible substrates by plasma-enha2023
Hydrophobic polyvinyl alcohol and method for preparing hydrophobic polyvinyl alc2023
Light switchable device2021
Resin composition and cured resin composition2020
Resin containing oxetane and epoxy groups and resin composition including the sa2018
Top emitting organic electroluminescent devices2017
Method for fabricating flexible electrical devices2015
Photosensitive composition and photoresist2015