Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for high density detachable electrical interface

Apparatus and method for high density detachable electrical interface

US Patent 11742605 · Granted Aug 29, 2023

Estimated economic value: $50,461,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and method for hybrid opto-electrical multichip module2024
Systems and methods for flexible, high-density opto-electronic arrays2024
Engineered current-density profile diode laser2024
CTE-tuned pyrolytic graphite (PG) substrate to minimize joining stress between l2023
Implantable neuromodulation system for closed-loop stimulation and recording sim2023
System and method for scalable optical interconnect for quantum computing2023
Engineered current-density profile diode laser2023
Si-based CTE-matched substrate for laser diode packaging2022
Cylindrical microelectrode array for neural stimulation and recording2022
System and method for compact electro-optical interface2022
Apparatus and method for hybrid opto-electrical multichip module2022
CTE-tuned pyrolytic graphite (PG) substrate to minimize joining stress between l2021