Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated passive device and fabrication method using a last through-substrate via

Integrated passive device and fabrication method using a last through-substrate via

US Patent 11735497 · Granted Aug 22, 2023

Estimated economic value: $114,475,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package electrical contact structures and related methods2025
Multi-chip system-in-package2025
Semiconductor package electrical contacts and related methods2025
Simulated moving-bed type chromatographic separation method and simulated moving2025
Substrate alignment systems and related methods2025
Fan-out wafer level packaging of semiconductor devices2025
Semiconductor package stress balance structures and related methods2025
Thinned semiconductor package and related methods2025
Semiconductor wafer and method of ball drop on thin wafer with edge support ring2024
Semiconductor device with backmetal and related methods2024
Semiconductor device with backmetal and related methods2024
Simulated moving-bed type chromatographic separation method and simulated moving2023