Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multilayer encapsulation stacks by atomic layer deposition

Multilayer encapsulation stacks by atomic layer deposition

US Patent 11732356 · Granted Aug 22, 2023

Estimated economic value: $40,609,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Modular wind turbine blade and connection structure thereof2025
Systems and methods for depositing low-K dielectric films2025
Method of metal oxide infiltration into photoresist2025
Molybdenum (0) precursors for deposition of molybdenum films2025
Molybdenum (0) precursors for deposition of molybdenum films2025
Dry etching with etch byproduct self-cleaning2025
Metal organonitrile precursors for thin film deposition2025
Metal organonitrile precursors for thin film deposition2025
Electronic device fabrication using area-selective deposition2025
Electronic device fabrication using area-selective deposition2025
Self-aligned double patterning with spatial atomic layer deposition2025
Self-aligned double patterning with spatial atomic layer deposition2025