Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same

Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same

US Patent 11728259 · Granted Aug 15, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Display device2025
Display screen or portion thereof with graphical user interface2025
Display screen or portion thereof with graphical user interface2025
Packaging substrate and semiconductor device comprising the same2025
Packaging substrate having element group in cavity unit and semiconductor device2025
Polypeptide, photoresist composition including the same, and method of forming p2025
Semiconductor structure and method for manufacturing preparing same2025
Signal randomization method and device of communication apparatus2025
Digital aircomp signaling2025
Method for aligning gradient symbols by using bias regarding aircomp in signal a2025
Battery and electronic device including the same2025
Mobile terminal having two cameras and method for storing images taken by two ca2025