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Method of manufacturing printed circuit board assemblies with engineered thermal paths
Method of manufacturing printed circuit board assemblies with engineered thermal paths
US Patent
11711885
· Granted Jul 25, 2023
Estimated economic value:
$14,116,000
ⓘ
Assignee
Ttm Technologies
Inventors
Rick Bauer
(1 patents)
Jerrad Martinson
(1 patents)
Shane Hoffstatter
(1 patents)
Doyle Laudal
(1 patents)
Mike Lugert
(1 patents)
Mike Len
(1 patents)
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