Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectromechanical structure with bonded cover

Microelectromechanical structure with bonded cover

US Patent 11685650 · Granted Jun 27, 2023

Estimated economic value: $41,378,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectromechanical system oven-controlled oscillator2025
Non-lid-bonded MEMS resonator with phosphorus dopant2025
Resonant elements and oscillators2025
Resonant elements and oscillators2025
MEMS resonator integrated cicruit fabrication2025
MEMS resonator integrated cicruit fabrication2025
MEMS resonator integrated cicruit fabrication2025
Gear motor including an electric motor and a gearbox2025
MEMS with small-molecule barricade2025
Planetary-gear mechanism with a driving shaft and a first sun gear2025
Cascaded oscillator designs2025
Resonator electrode shields2025