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Home › Packaging structure including a substrate having a coplanar waveguide, an air bridge and a superconducting material compensating structure formed thereon

Packaging structure including a substrate having a coplanar waveguide, an air bridge and a superconducting material compensating structure formed thereon

US Patent 11658373 · Granted May 23, 2023

Estimated economic value: $317,459,000 ⓘ

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