Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structures and methods for heat dissipation of semiconductor devices

Structures and methods for heat dissipation of semiconductor devices

US Patent 11658088 · Granted May 23, 2023

Estimated economic value: $13,949,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Structures and methods for heat dissipation of semiconductor devices2025
Structures and methods for heat dissipation of semiconductor devices2025
Structures and methods for heat dissipation of semiconductor devices2025
Micro-electromechanical system device using a metallic movable part and methods 2024
Structures and methods for heat dissipation of semiconductor devices2021
Structures and methods for heat dissipation of semiconductor devices2021
Structures and methods for heat dissipation of semiconductor devices2021
Multi-layer structure for high aspect ratio etch2017
Defect inspection apparatus and method2015