Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having inner lead exposed from sealing resin, semiconductor device manufacturing method thereof, and power converter including the semiconductor device

Semiconductor device having inner lead exposed from sealing resin, semiconductor device manufacturing method thereof, and power converter including the semiconductor device

US Patent 11652032 · Granted May 16, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of manufacturing the same2025
Power semiconductor device and manufacturing method thereof2023
Transfer-mold type power module and lead frame2022
Semiconductor apparatus, power conversion device, and method for manufacturing s2022
Method for manufacturing resin-sealed power semiconductor device2021
Semiconductor device and manufacturing method thereof2018
Power semiconductor device2017