Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › 3-D package structure for isolated power module and the method thereof

3-D package structure for isolated power module and the method thereof

US Patent 11652029 · Granted May 16, 2023

Estimated economic value: $201,074,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-level buck converter and associate control circuit thereof2025
Multi-level buck converter and associate control circuit thereof2025
Flip chip package unit and associated packaging method2025
Flip chip package unit comprising thermal protection film and associated packagi2024
Multi-die package structure and multi-die co-packing method2024
Integrated circuit package structure and integrated circuit package unit2023
Power switch device driver with energy recovering and the method thereof2023
Power switch device driver with energy recovering and the method thereof2023
Gate driver with improved switching performance and the driving method thereof2023
Gate driver with improved switching performance and the driving method thereof2023
Panel level metal wall grids array for integrated circuit packaging2023
Integrated circuit package structure, integrated circuit package unit and associ2023