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Home › Well thermalized stripline formation for high-density connections in quantum applications

Well thermalized stripline formation for high-density connections in quantum applications

US Patent 11621466 · Granted Apr 4, 2023

Estimated economic value: $5,091,000 ⓘ

Assignee

IBM

Inventors

Salvatore Bernardo Olivadese (67 patents)
Patryk Gumann (75 patents)
Jerry M. Chow (84 patents)

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