Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of manufacturing a semiconductor device with self-aligning landing pad

Method of manufacturing a semiconductor device with self-aligning landing pad

US Patent 11610895 · Granted Mar 21, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for preparing memory array with contact enhancement cap2025
Capacitors with electrodes having a portion of material removed, and related sem2025
Memory array with contact enhancement cap and method for preparing the memory ar2024
Method for preparing semiconductor device structure with lining layer2024
Method for fabricating semiconductor device with intervening layer2024
Method of forming a memory device2023
Method for preparing memory array with contact enhancement cap2023
Semiconductor device and method for fabricating the same2023
Semiconductor device with intervening layer and method for fabricating the same2023
Method for fabricating semiconductor device with active interposer2023
Method for fabricating a semiconductor device2022
Semiconductor device with active interposer and method for fabricating the same2022