Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Adhesive-free bonding of dielectric materials, using nanojet microstructures

Adhesive-free bonding of dielectric materials, using nanojet microstructures

US Patent 11598969 · Granted Mar 7, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device for near-field focusing and beam forming2025
Device for forming an outgoing electromagnetic wave from an incident electromagn2024
Device for deviating and focusing light2024
Diffraction grating comprising double-materials structures2023
Image sensor comprising pixels for preventing or reducing the crosstalk effect2022
Optical device capable of providing at least two different optical functions2022
Device for forming at least one tilted focused beam in the near zone, from incid2022
Device for forming a field intensity pattern in the near zone, from incident ele2021
Device and method for shielding at least one sub-wavelength-scale object from an2021
Device for forming nanojet beams in a near zone, from incident electromagnetic w2021
Organic light emitting diode cell comprising a set of right circular hollow cyli2021
Device for electromagnetic dosimetry and associated method2020