Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Systems and methods for cooling an electronic device via interface of a heat-transfer conduit of the electronic device to a cold plate assembly

Systems and methods for cooling an electronic device via interface of a heat-transfer conduit of the electronic device to a cold plate assembly

US Patent 11596086 · Granted Feb 28, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Efficiency-adjusted hardware resource capacity to support a workload placement d2025
Electronic device with below PCB thermal management2025
Optimizing waste heat recovery and return water temperature using dynamic flow c2024
Optimizing waste heat recovery and return water temperature using dynamic flow c2024
Method to allow for higher usable power capacity in a redundant power configurat2023
Interposer for a CPU socket to provide a serial computer expansion bus connectio2023
Interposer for a CPU socket to provide a serial computer expansion bus connectio2023
Thermoelectric cooler systems for thermal enhancement in immersion cooling and a2023
Systems and methods for controlling air distribution to electronic components2021
Dynamically loading firmware based on geographic location2020
IHS component cooling system2020
Mapped fan zone cooling system2020