Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of facilitating straining of a semiconductor element for semiconductor fabrication, semiconductor platform obtained by the method, and optoelectronic device comprising the semiconductor platform

Method of facilitating straining of a semiconductor element for semiconductor fabrication, semiconductor platform obtained by the method, and optoelectronic device comprising the semiconductor platform

US Patent 11581451 · Granted Feb 14, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of reducing semiconductor substrate surface unevenness2024
Amorphous germanium waveguides for spectroscopic sensing and data communication 2023
Amorphous germanium waveguides for spectroscopic sensing and data communication 2021
Simultaneous electrical and optical connections for flip chip assembly2021
Strained germanium silicon optical modulator array including stress materials2021
Strained germanium silicon optical modulator array including stress materials2021
Semiconductor device with a through-substrate via hole having therein a capacito2021
Method for high-concentration doping of germanium with phosphorous2020
Fabrication of a device on a carrier substrate2020
Optical structure and method of forming the same2020
Method of encapsulating a substrate2019
Method of manufacturing a substrate with reduced threading dislocation density2019