Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal structures for heat transfer devices and spatial power-combining devices

Thermal structures for heat transfer devices and spatial power-combining devices

US Patent 11564337 · Granted Jan 24, 2023

Estimated economic value: $42,221,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hermetic package for high CTE mismatch2025
Hermetic package for high CTE mismatch2024
Structural arrangements for spatial power-combining devices2024
High power laminate RF package2023
Thermal structures for heat transfer devices and spatial power-combining devices2023
Power-combining devices with increased output power2023
Safety gate for a stove2022
Heat exchanger assemblies for electronic devices2022
Heat exchanger assemblies for electronic devices and related methods2021
Structures for spatial power-combining devices2020
Heat transfer device incorporating a helical flow element within a fluid conduit2020
Environmentally robust plating configuration for metal-diamond composites substr2019