Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic component assembly with thermally conductive structures for image sensors

Electronic component assembly with thermally conductive structures for image sensors

US Patent 11553116 · Granted Jan 10, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for preparing semiconductor device structure with energy removable spacer2025
Electronic component assembly with thermally conductive structures for image sen2025
Electronic component assembly with thermally conductive structures for image sen2025
Electronic component assembly with thermally conductive structures for image sen2025
Electronic component assembly with thermally conductive structures for image sen2025
Electronic component assembly with thermally conductive structures for image sen2025
Method and composition for quantifying protein using tagged standards2025
Method and composition for quantifying protein using tagged standards2025
Heterojunction semiconductor device with low on-resistance2025
Non-destructive measurement method and apparatus for the turn-to-turn resistivit2025
Semiconductor device with composite gate dielectric and method for preparing the2024
Contact imaging of standards with illumination2024