Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor assemblies with redistribution structures for die stack signal routing

Semiconductor assemblies with redistribution structures for die stack signal routing

US Patent 11552045 · Granted Jan 10, 2023

Estimated economic value: $13,847,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Perpendicular semiconductor device assemblies and associated methods2025
Semiconductor device with tunable antenna using wire bonds2025
Identifying data in a number of images to transform with identification of a bla2025
Semiconductor devices with flexible reinforcement structure2025
Semiconductor assemblies with redistribution structures for die stack signal rou2025
Semiconductor assemblies with redistribution structures for die stack signal rou2025
Semiconductor assemblies with redistribution structures for die stack signal rou2025
Semiconductor assemblies with redistribution structures for die stack signal rou2025
Semiconductor assemblies with redistribution structures for die stack signal rou2025
Memory device interface and method2025
Tunable integrated millimeter wave antenna using laser ablation and/or fuses2025
Security notification based on biometric identifier2025