Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip package structure, electronic device and method for preparing a chip package structure

Chip package structure, electronic device and method for preparing a chip package structure

US Patent 11545517 · Granted Jan 3, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chip package structure and electronic device2022
Chip package structure, chip package method and terminal device2021
Optical module, fabrication method thereof, and terminal device using the same2020
Package structure, electronic device and method for manufacturing package struct2018