Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming electrical connections with solder dispensing and reflow

Method of forming electrical connections with solder dispensing and reflow

US Patent 11541471 · Granted Jan 3, 2023

Estimated economic value: $16,586,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Mounting supports that create a bond pad gap for a hard disk slider2023
Fastener assembly2023
Mounting supports that create a bond pad gap for a hard disk slider2022
Fluidization of agglomerated solder microspheres2022
Methods of controlling a shape and size of solder joints of magnetic recording h2021
Electrically conductive solder non-wettable bond pads in head gimbal assemblies2020
Method of forming electrical connections using optical triggering for solder2020
Method of forming electrical connections using optical triggering for solder2020
Slider with bondable surface opposite suspension trace2020
Slider with bondable surface opposite suspension trace2020
Slider with trailing edge top bond pad interconnect2020
Slider with trailing edge top bond pad interconnect2020