Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Circuit arrangement consisting of two interconnected high-frequency components

Circuit arrangement consisting of two interconnected high-frequency components

US Patent 11539151 · Granted Dec 27, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Waffle iron filter arrangement for high-frequency signals2025
Ridged waveguide arrangement containing a first ridge waveguide overlapping a se2025
Radio-frequency assembly with impedance matching filter2025
Radio-frequency assembly with impedance matching filter2025
Swivelling mechanism for communication units2024
Amplifier with power combination and internal redundancy and modular housing2024
Metering pump with temporary reversal of direction of the displacement element2024
Printing press and method for cleaning at least one nozzle bar of at least one p2023
Printing press and method for cleaning at least one nozzle bar of at least one p2023
Resonator with a dielectric element including first and second chambers therein 2023
Rotatable coaxial switching device including electrical connections configured f2022
Resonator with temperature compensation2022