Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal solutions for package on package (PoP) architectures

Thermal solutions for package on package (PoP) architectures

US Patent 11538731 · Granted Dec 27, 2022

Estimated economic value: $12,365,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Technologies for shielding an inductor on a circuit board2025
Thermal management systems for electronic devices and related methods2025
Solderless or groundless electromagnetic shielding in electronic devices2025
Thermal conduction band for improved mobile computing device performance2025
External cooling solution for mobile computing devices2025
External cooling solution for mobile computing devices2025
Memory module connector for thin computing systems2025
Extending virtual routing and forwarding2024
Socket interposer for system-in-package (SIP) module qualification in product pl2024
Apparatus and methods for thermal management of electronic user devices based on2024
Apparatus and methods for thermal management of electronic user devices based on2024
Fan support2024