Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor devices having bonding structures with bonding pads and metal patterns

Semiconductor devices having bonding structures with bonding pads and metal patterns

US Patent 11532581 · Granted Dec 20, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device and control method thereof2025
X-ray imaging device and control method thereof2025
Semiconductor device2025
Display apparatus2025
Electronic device and control method thereof2025
Aluminium alloy for die casting, method for manufacturing same, and die casting 2025
X-ray imaging apparatus and X-ray image processing method2024
Semiconductor chip structure2024
Semiconductor device and method of manufacturing the same2024
Antenna-in-package devices and methods of making2024
Semiconductor device2024
Device including first structure having peripheral circuit and second structure 2024